TSMC Raises $3.5 Billion in Bonds for its U.S Factory

Taiwan based computer chip manufacturer TSMC (TPE: 2330) announced having raised $3.5 billion in bonds for its new factory in the U.S State of Arizona. This development was revealed through a term sheet shared by the company on April 20.

Taiwan Semiconductor Manufacturing Co Ltd (TSMC) is a major supplier of leading tech company and iPhone manufacturer Apple Inc. (AAPL). TMSC is currently the world’s largest contract chip manufacturer.

Since the COVID-19 pandemic set foot in the world, the ere has been a global shortage of computer chips which has affected many industries including the automobile industry where car makers have been forced to halt productions due to the chip shortage.

TSMC begun construction at the Arizona site last year, the company is planning to spend $12 billion to build a computer chip factory in the same site.

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